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Project case study

Kinetiq

Multi-Node Wearable Network for Real-Time Motion Analytics

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Project Overview

Kinetiq is an interactive, motion-tracking platform designed to deliver high-precision kinematic feedback for physical rehabilitation and gamified fitness applications. Operating under an aggressive rapid-prototyping timeline, Elonic engineered, routed, and validated the core sensor node architecture—delivering a synchronized, multi-node tracking platform built to eliminate spatial tracking ambiguity in real time.

The Challenge

Single-point wearable trackers fail to capture complex biomechanical articulation and joint compensations. Developing a multi-node tracking system within a tight development sprint presented critical engineering hurdles:

  • High Subsystem Density: Integrating Ultra-Wideband (UWB) ranging, a 9-DoF IMU, magnetometer, barometric sensing, single-cell Li-Po power management, and an ESP32-S3 host MCU into a compact 38x40mm footprint.
  • RF & EMC De-Risking: Eliminating lengthy antenna matching iterations and boot-loop risks on a rapid turnaround schedule.

The Solution: High-Density 4-Layer Modular Architecture

To guarantee zero-revision functional bring-up and robust noise immunity within the physical boundary, the node was engineered around a derisking-first component strategy and an optimized stackup:

  • Component Derisking Strategy:
    • Utilized pre-certified, metal-shielded RF modules for the ESP32-S3 and UWB transceivers to eliminate discrete silicon layout risk and bypass complex RF matching loops.
    • Integrated an unbroken copper keepout beneath the antenna zone while preserving the FR4 substrate, maintaining full structural rigidity without cutting fragile edge slots.
  • 4-Layer Noise-Immune PCB Stackup:
    • Layer 1 (Top Signal)
    • Layer 2 (Internal GND)
    • Layer 3 (Internal GND/Power)
    • Layer 4 (Bottom Signal)

Engineering Highlights

  • First-Pass Reliability: Achieved 100% first-pass DRC compliance with zero trace cuts, jumpers, or silicon re-spins required on initial power-up.
  • Dual-Plane Noise Floor: Dual unbroken internal ground planes provided clean isolation for high-precision sensor acquisition and clean RF radiation patterns.
  • Integrated Strain Relief: Strategic two-point mechanical mounting, one placed directly beside the USB Type-C receptacle prevents solder-joint fatigue from repetitive cable insertion forces.
  • Turnkey Execution: Complete end-to-end delivery spanning architecture definition, multi-layer PCB design and DFM optimization.

Technical Specifications

  • System Architecture: Distributed Multi-Node Wireless Tracking Mesh
  • Form Factor: 38 x 40 mm
  • PCB Stackup: 4-Layer Controlled-Impedance FR4 with Dual Internal Ground Planes
  • Core Compute: ESP32-S3 Dual-Core MCU
  • Wireless & Ranging: Ultra-Wideband (UWB) Ranging & BLE Streaming
  • Sensing Suite: 9-Axis IMU, Magnetometer & Barometric Pressure Sensor
  • Power Management: USB Type-C Input with Single-Cell Li-Po Charging
  • Target Application: Clinical Kinematic Analysis & Gamified Fitness Motion Tracking